Development of a Tabletop Deep Reactive-Ion Etching System for MEMS Development and Production

A Tabletop Deep Reactive Ion Etching System for MEMS Development and Production

Development and Optimization of Integrative MEMS-Based Gray-Scale Technology In Silicon For Power MEMS Applications

As the field of micro-electro-mechanical systems (MEMS) has diversified, a growing number of applications are limited by the current planar technology available for fabrication. Gray-scale technology offers a method of fabricating 3-D structures in MEMS utilizing a single lithography step. Before gray-scale technology can be accepted as a universal/standard fabrication technique, methods for co...

MEMS and FOG Technologies for Tactical and Navigation Grade Inertial Sensors—Recent Improvements and Comparison

In the following paper, we present an industry perspective of inertial sensors for navigation purposes driven by applications and customer needs. Microelectromechanical system (MEMS) inertial sensors have revolutionized consumer, automotive, and industrial applications and they have started to fulfill the high end tactical grade performance requirements of hybrid navigation systems on a series ...

Three Dimensional MEMS Supercapacitor Fabricated by DRIE on Silicon Substrate

Micro power sources are required to be used in autonomous microelectromechanical system (MEMS). In this paper, we designed and fabricated a three dimensional (3D) MEMS supercapacitor, which is consisting of conformal silicon dioxide/titanium/polypyrrole (PPy) layers on silicon substrate. At first, through-structure was fabricated on the silicon substrate by high-aspect-ratio deep reactive ion e...

A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding

This paper presents the development and characterization of a new high-aspect-ratio MEMS process. The silicon-on-silicon (SOS) process utilizes dielectric barrier discharge surface activated low-temperature wafer bonding and deep reactive ion etching to achieve a high aspect ratio (feature width reduction-to-depth ratio of 1:31), while allowing for the fabrication of devices with a very high an...